Thermal and Mechanical Analyses of Clamping Area on the Performance of Press-Pack IGBT in Series-Connection Stack Application
| Title: | Thermal and Mechanical Analyses of Clamping Area on the Performance of Press-Pack IGBT in Series-Connection Stack Application |
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| Authors: | Dai, S.; Wang, Z.; Wu, H.; Song, X.; Li, G.; Pickert, V. |
| Source: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 11(2):200-211 Feb, 2021 |
| Database: | IEEE Xplore Digital Library |