| Title: |
A high-density logic-on-logic 3DIC design using face-to-face hybrid wafer-bonding on 12nm FinFET process |
| Authors: |
Sinha, S.; Hung, S; Fisher, D.; Xu, X.; Chao, C.; Chandupatla, P.; Frederick, F.; Perry, H.; Smith, D.; Cestero, A.; Safran, J.; Ayyavu, V.; Bhargava, M.; Mathur, R.; Prasad, D.; Katz, R.; Kinsbruner, A.; Garant, J.; Lubguban, J.; Knickerbocker, S.; Soler, V.; Cline, B.; Christy, R.; McLaurin, T.; Robson, N.; Berger, D. |
| Source: |
2020 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2020 IEEE International. :15.1.1-15.1.4 Dec, 2020 |
| Relation: |
2020 IEEE International Electron Devices Meeting (IEDM) |
| Database: |
IEEE Xplore Digital Library |