Concept and Process Development Using Ex Situ Fabricated High-Density Interconnect Plugs for Circuit-Board Embedded Magnetic Components
| Title: | Concept and Process Development Using Ex Situ Fabricated High-Density Interconnect Plugs for Circuit-Board Embedded Magnetic Components |
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| Authors: | Bowen, D.B.; Basu, D.; Stackhouse, G. |
| Source: | IEEE Transactions on Magnetics IEEE Trans. Magn. Magnetics, IEEE Transactions on. 59(6):1-6 Jun, 2023 |
| Database: | IEEE Xplore Digital Library |