| Title: |
A Review of Low Temperature Process Modules Leading Up to the First (≤500 °C) Planar FDSOI CMOS Devices for 3-D Sequential Integration |
| Authors: |
Fenouillet-Beranger, C.; Brunet, L.; Batude, P.; Brevard, L.; Garros, X.; Casse, M.; Lacord, J.; Sklenard, B.; Acosta-Alba, P.; Kerdiles, S.; Tavernier, A.; Vizioz, C.; Besson, P.; Gassilloud, R.; Pedini, J.; Kanyandekwe, J.; Mazen, F.; Magalhaes-Lucas, A.; Cavalcante, C.; Bosch, D.; Ribotta, M.; Lapras, V.; Vinet, M.; Andrieu, F.; Arcamone, J. |
| Source: |
IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 68(7):3142-3148 Jul, 2021 |
| Database: |
IEEE Xplore Digital Library |