| Title: |
Towards $5\mu \mathrm{m}$ interconnection pitch with Die-to-Wafer direct hybrid bonding |
| Authors: |
Bourjot, Emilie; Castan, Clement; Nadi, Noura; Bond, Alice; Bresson, Nicolas; Sanchez, Loic; Fournel, Frank; Raynaud, Nicolas; Metzger, Pascal; Cheramy, Severine |
| Source: |
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :470-475 Jun, 2021 |
| Relation: |
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |