Impact of warpage on signal delivery with large size FC-PBGA package
| Title: | Impact of warpage on signal delivery with large size FC-PBGA package |
|---|---|
| Authors: | Lee, Heeseok; Hwang, Jisoo; Kwon, Henry H.; Pak, Junso |
| Source: | 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :1738-1743 Jun, 2021 |
| Relation: | 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) |
| Database: | IEEE Xplore Digital Library |