| Title: |
System in package embedding III-V chips by fan-out wafer-level packaging for RF applications |
| Authors: |
Garnier, Arnaud; Castagne, Laetitia; Greco, Florent; Guillemet, Thomas; Marechal, Laurent; Neffati, Mehdy; Franiatte, Remi; Coudrain, Perceval; Piotrowicz, Stephane; Simon, Gilles |
| Source: |
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :2016-2023 Jun, 2021 |
| Relation: |
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |