| Title: |
Record Performance of 500°C Low-Temperature nMOSFETs for 3D Sequential Integration using a Smart CutTM Layer Transfer Module |
| Authors: |
Brunet, L.; Reboh, S.; Januel, T.; Garros, X.; Frutuoso, T. Mota; Casse, M.; Sklenard, B.; Brevard, L.; Ribotta, M.; Magalhaes-Lucas, A.; Kanyandekwe, J.; Hartmann, J.-M.; Milesi, F.; Mazen, F.; Acosta-Alba, P.; Kerdiles, S.; Tavernier, A.; Loup, V.; Morales, C.; Larrey, V.; Fournel, F.; Van-Jodin, L. Le; Leforestier, S.; Rolland, E.; Romano, G.; Gaudin, G.; Lugo, J.; Lacord, J.; Maitrejean, S.; Arcamone, J.; Batude, P.; Radu, I.; Fenouillet-Beranger, C.; Andrieu, F. |
| Source: |
2021 Symposium on VLSI Technology VLSI Technology, 2021 Symposium on. :1-2 Jun, 2021 |
| Relation: |
2021 Symposium on VLSI Technology |
| Database: |
IEEE Xplore Digital Library |