| Title: |
Opportunities and challenges brought by 3D-sequential integration |
| Authors: |
Batude, P.; Brunet, L.; Fenouillet-Beranger, C.; Lattard, D.; Andrieu, F.; Vinet, M.; Brevard, L.; Ribotta, M.; Previtali, B.; Tabone, C.; Ponthenier, F.; Rambal, N.; Sideris, P.; Garros, X.; Casse, M.; Theodorou, C.; Sklenard, B.; Lacord, J.; Besson, P.; Fournel, F.; Kerdiles, S.; Acosta-Alba, P.; Mazzocchi, V.; Hartmann, J-M.; Mazen, F.; Thuries, S.; Billoint, O.; Vivet, P.; Sicard, G.; Cibrario, G.; Mouhdach, M.; Giraud, B.; Ribotta, CM.; Lapras, V. |
| Source: |
2021 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2021 IEEE International. :1-1 Jul, 2021 |
| Relation: |
2021 IEEE International Interconnect Technology Conference (IITC) |
| Database: |
IEEE Xplore Digital Library |