| Title: |
Investigation and Modeling of Etching Through Silicon Carbide Vias (TSiCV) for SiC Interposer and Deep SiC Etching for Harsh Environment MEMS by DoE |
| Authors: |
Mackowiak, P.; Erbacher, K.; Schiffer, M.; Manier, C.; Topper, M.; Ngo, H.; Schneider-Ramelow, M.; Lang, K. |
| Source: |
IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(3):437-445 Mar, 2022 |
| Database: |
IEEE Xplore Digital Library |