Glass Molded Optical Interposers for Wafer Scale Datacom Component Packaging
| Title: | Glass Molded Optical Interposers for Wafer Scale Datacom Component Packaging |
|---|---|
| Authors: | Merget, F.; Ackermann, M.; Shen, B.; Saunders, G. D.; Haag, S.; Wolz, M.; Witzens, J. |
| Source: | 2021 European Conference on Optical Communication (ECOC) Optical Communication (ECOC), 2021 European Conference on. :1-4 Sep, 2021 |
| Relation: | 2021 European Conference on Optical Communication (ECOC) |
| Database: | IEEE Xplore Digital Library |