HCI SOA Enhancement for EDNMOS with Metal Field Plate
| Title: | HCI SOA Enhancement for EDNMOS with Metal Field Plate |
|---|---|
| Authors: | Soon, J. M.; Tan, P. Y.; Eng, C. W.; Cai, M.; Li, M. |
| Source: | 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2021 IEEE International Symposium on the. :1-4 Sep, 2021 |
| Relation: | 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) |
| Database: | IEEE Xplore Digital Library |