Intermetallic Growth and Void Formation Mechanism in Flip Chip Copper Pillar Interconnects: Role of the Underfill Material
| Title: | Intermetallic Growth and Void Formation Mechanism in Flip Chip Copper Pillar Interconnects: Role of the Underfill Material |
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| Authors: | Wang, Miao; Uehling, Trent; Mavinkurve, Amar; Uehling, Paige; Ahmed, Sudan; Foong, Cs |
| Source: | 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2021 IEEE 23rd. :121-125 Dec, 2021 |
| Relation: | 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) |
| Database: | IEEE Xplore Digital Library |