Heterogeneous Integration on Fan-Out Wafer Level Packaging Platform
| Title: | Heterogeneous Integration on Fan-Out Wafer Level Packaging Platform |
|---|---|
| Authors: | Chai, Tc; Ho, David; Chong, Sc; Sharon Lim, Ps; Hsiao, Hy; Soh, Jacob |
| Source: | 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2021 IEEE 23rd. :248-252 Dec, 2021 |
| Relation: | 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) |
| Database: | IEEE Xplore Digital Library |