| Title: |
Modelling of vertical and ferroelectric junctionless technology for efficient 3D neural network compute cube dedicated to embedded artificial intelligence |
| Authors: |
Maneux, C.; Mukherjee, C.; Deng, M.; Dubourg, M.; Reveil, L.; Bordea, G.; Lecestre, A.; Larrieu, G.; Trommer, J.; Breyer, E.T.; Slesazeck, S.; Mikolajick, T.; Baumgartner, O.; Karner, M.; Pirker, D.; Stanojevic, Z.; Atienza, David; Levisse, A.; Ansaloni, G.; Poittevin, A.; Bosio, A.; Deleruyelle, D.; Marchand, C.; O'Connor, I. |
| Source: |
2021 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2021 IEEE International. :15.6.1-15.6.4 Dec, 2021 |
| Relation: |
2021 IEEE International Electron Devices Meeting (IEDM) |
| Database: |
IEEE Xplore Digital Library |