| Title: |
A 1-Tb 4b/Cell 4-Plane 162-Layer 3D Flash Memory With a 2.4-Gb/s I/O Speed Interface |
| Authors: |
Yuh, Jong; Li, Jason; Li, Heguang; Oyama, Yoshihiro; Hsu, Cynthia; Anantula, Pradeep; Jeong, Stanley; Amarnath, Anirudh; Darne, Siddhesh; Bhatia, Sneha; Tang, Tianyu; Arya, Aditya; Rastogi, Naman; Ookuma, Naoki; Mizukoshi, Hiroyuki; Yap, Alex; Wang, Demin; Kim, Steve; Wu, Yonggang; Peng, Min; Lu, Jason; Ip, Tommy; Malhotra, Seema; Han, David; Okumura, Masatoshi; Liu, Jiwen; Sohn, John; Chibvongodze, Hardwell; Balaga, Muralikrishna; Matsuda, Aki; Puri, Chakshu; Chen, Chen; V, Indra K; G, Chaitanya; Ramachandra, Venky; Kato, Yosuke; Kumar, Ravi; Wang, Huijuan; Moogat, Farookh; Yoon, In-Soo; Kanda, Kazushige; Shimizu, Takahiro; Shibata, Noboru; Shigeoka, Takashi; Yanagidaira, Kosuke; Kodama, Takuyo; Fukuda, Ryo; Hirashima, Yasuhiro; Abe, Mitsuhiro |
| Source: |
2022 IEEE International Solid-State Circuits Conference (ISSCC) Solid-State Circuits Conference (ISSCC), 2022 IEEE International. 65:130-132 Feb, 2022 |
| Relation: |
2022 IEEE International Solid-State Circuits Conference (ISSCC) |
| Database: |
IEEE Xplore Digital Library |