Epoxy Mold Compound Encapsulation Concept for Large-Area Power Devices
| Title: | Epoxy Mold Compound Encapsulation Concept for Large-Area Power Devices |
|---|---|
| Authors: | Dobrzynska, J.A.; Vobecky, J.; Gradinger, T.B.; Guillon, D.; Corvasce, C. |
| Source: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(4):602-609 Apr, 2022 |
| Database: | IEEE Xplore Digital Library |