| Title: |
III-V on a Si platform for the next generations of communication systems |
| Authors: |
Parvais, B.; Vais, A.; Yadav, S.; Mols, Y.; Vermeersch, B.; Kodanarama, K. Vondkar; Boccardi, G.; Kunert, B.; Collaert, N. |
| Source: |
2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2022 6th IEEE. :250-252 Mar, 2022 |
| Relation: |
2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) |
| Database: |
IEEE Xplore Digital Library |