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Modeling High-Frequency and DC Path of Embedded Discrete Capacitor Connected by Double-Side Terminals with Multi-layered Organic Substrate and RDL-based Fan-out Package

Title:	Modeling High-Frequency and DC Path of Embedded Discrete Capacitor Connected by Double-Side Terminals with Multi-layered Organic Substrate and RDL-based Fan-out Package
Authors:	Lee, Heeseok; Hwang, Kyojin; Kwon, Henry; Hwang, Jisoo; Pak, Junso; Choi, Ju Yeon
Source:	2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :2217-2221 May, 2022
Relation:	2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
Database:	IEEE Xplore Digital Library