Co-design of Thermal Management with System Architecture and Power Management for 3D ICs
| Title: | Co-design of Thermal Management with System Architecture and Power Management for 3D ICs |
|---|---|
| Authors: | Roy, Rishav; Das, Shidhartha; Labbe, Benoit; Mathur, Rahul; Jeloka, Supreet |
| Source: | 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :211-220 May, 2022 |
| Relation: | 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) |
| Database: | IEEE Xplore Digital Library |