| Title: |
5.12 Tbps Co-Packaged FPGA and Silicon Photonics Interconnect I/O |
| Authors: |
Hosseini, Kaveh; Kok, Edwin; Shumarayev, Sergey Y.; Jeong, Daniel; Chan, Allen; Katzin, Austin; Liu, Songtao; Roucka, Radek; Raval, Manan; Mac, Minh; Chiu, Chia-Pin; Tran, Thungoc; Singh, Kumar Abhishek; Raman, Sangeeta; Ke, Yanjing; Li, Chen; Yang, Li-Fan; Chao, Paulo; Lu, Haiwei; Luna, Fernando; Li, Xiaoqian; Hoang, Tim Tri; Sarkar, Arnab; Toda, Asako; Mahajan, Ravi; Deshpande, Nitin; O'Keeffe, Conor; Krishnamoorthy, Uma; Stojanovic, Vladimir; Madden, Chris; Zhang, Chong; Sysak, Matt; Bhargava, Pavan; Sun, Chen; Wade, Mark |
| Source: |
2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) VLSI Technology and Circuits (VLSI Technology and Circuits), 2022 IEEE Symposium on. :260-261 Jun, 2022 |
| Relation: |
2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) |
| Database: |
IEEE Xplore Digital Library |