| Title: |
Demonstration of 3D sequential FD-SOI on CMOS FinFET stacking featuring low temperature Si layer transfer and top tier device fabrication with tier interconnections |
| Authors: |
Vandooren, A.; Parihar, N.; Franco, J.; Loo, R.; Arimura, H.; Rodriguez, R.; Sebaai, F.; Iacovo, S.; Vandersmissen, K.; Li, W.; Mannaert, G.; Radisic, D.; Rosseel, E.; Hikavyy, A.; Jourdain, A.; Mourey, O.; Gaudin, G.; Reboh, S.; Van-Jodin, L. Le; Besnard, G.; Neve, C. Roda; Nguyen, B-Y.; Radu, I.; Litta, E. Dentoni; Horiguchi, N. |
| Source: |
2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) VLSI Technology and Circuits (VLSI Technology and Circuits), 2022 IEEE Symposium on. :330-331 Jun, 2022 |
| Relation: |
2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) |
| Database: |
IEEE Xplore Digital Library |