| Title: |
Multiphysics Coupling Analysis and Structural Optimization of High Density TSVs in Microsystems |
| Authors: |
Wang, Yong; Zhang, Tao; Feng, Changlei; Zhou, Zheng; Xia, JingChao; Wu, Peng; Zhang, Wei; Yang, Li |
| Source: |
2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-6 Aug, 2022 |
| Relation: |
2022 23rd International Conference on Electronic Packaging Technology (ICEPT) |
| Database: |
IEEE Xplore Digital Library |