| Title: |
Pixel Pitch Hybrid Bonding and Three Layer Stacking Technology for BSI Image Sensor |
| Authors: |
Tanida, K.; Suzuki, S.; Seo, T.; Morinaga, M.; Korogi, H.; Tetani, M.; Hamada, M.; Eto, R.; Yamashita, T.; Kato, Y.; Sato, N.; Shimizu, T.; Hanawa, T.; Kubo, H.; Ueda, K.; Ito, F.; Noguchi, Y.; Nakamura, M.; Mizukoshi, R.; Takeuchi, M.; Suzuki, M.; Niisoe, N.; Miyanaga, I.; Ikeda, A.; Matsumoto, S. |
| Source: |
2022 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2022 IEEE International. :5-7 Jun, 2022 |
| Relation: |
2022 IEEE International Interconnect Technology Conference (IITC) |
| Database: |
IEEE Xplore Digital Library |