Thermal conductivity characterization of an in-house formulated thermal insulating xerogel - epoxy composite adhesive for electronics applications
| Title: | Thermal conductivity characterization of an in-house formulated thermal insulating xerogel - epoxy composite adhesive for electronics applications |
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| Authors: | Stoukatch, Serguei; Fagnard, Jean-Francois; Roy, Geoffrey; Laurent, Philippe; Dupont, Francois; Jacques, Pascal J.; Redoute, Jean-Michel |
| Source: | 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2022 IEEE 9th. :315-320 Sep, 2022 |
| Relation: | 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) |
| Database: | IEEE Xplore Digital Library |