Effects of Bonding Process Parameters on Wafer-to-Wafer Alignment Accuracy in Benzocyclobutene (BCB) Dielectric Wafer Bonding
| Title: | Effects of Bonding Process Parameters on Wafer-to-Wafer Alignment Accuracy in Benzocyclobutene (BCB) Dielectric Wafer Bonding |
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| Authors: | Niklaus, F.Aff1; Kumar, R. J.Aff1; McMahon, J. J.Aff1; Yu, J.Aff1; Matthias, T.Aff1, Aff2; Wimplinger, M.Aff1, Aff3; Lindner, P.Aff1, Aff2; Lu, J. Q.Aff1; Cale, T. S.Aff1; Gutmann, R. J.Aff1 |
| Source: | MRS Online Proceedings Library. 863(1) |
| Database: | Springer Nature Journals |