Thermal stability enhancement of low temperature Cu-Cu bonding using metal passivation technology for advanced electronic packaging
| Title: | Thermal stability enhancement of low temperature Cu-Cu bonding using metal passivation technology for advanced electronic packaging |
|---|---|
| Authors: | Hsu, Mu-PingAff1; Lin, Tai-YuAff1; Huang, Hua-JingAff2; Wang, Chiao-YenAff1; Chung, Tsai-FuAff2; Wu, Wen-WeiAff2; Chen, Kuan-NengAff1, IDs4417202500551x_cor1 |
| Source: | Communications Engineering. 4(1) |
| Database: | Springer Nature Journals |