7
Global Perspectives, Local Impact: Chinese Students' Role in Global Higher Education

von Xuefan Li ; Tingsong Li ; Donghua Li ; et al.

Journal of International Students. 2026 16(4):103-212.

Schlagworte: Global Approach; Higher Education; Student Role; Educational Policy; Admissions Officers; Foreign Countries; Foreign Students; Student Mobility; Administrator Attitudes; Private Colleges; Public Colleges
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8
The Impact of Analogical Learning and the Feynman Technique on English Achievement and Reasoning Ability in Grade Six: An Experimental Study

von Aihua Cheng ; Nirat Jantharajit ; Supawadee Kanjanakate

Journal of English Teaching. 2026 12(1):40-51.

Schlagworte: Foreign Countries; Elementary School Students; Grade 6; English (Second Language); Second Language Learning; Educational Strategies; Language Proficiency; Academic Achievement; Thinking Skills; Intervention; Peer Teaching; Logical Thinking
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9
Understanding Teacher Workload in Blended Learning: Insights through the Job Demands-Resources Model

von Zhao Cheng ; Fan Yang ; Chang Zhu

Electronic Journal of e-Learning. 2026 24(1):125-137.

Schlagworte: Faculty Workload; Blended Learning; Elementary School Teachers; Secondary School Teachers; Teacher Attitudes; Teaching Conditions; Foreign Countries; Teaching Experience; Barriers; Educational Strategies; Teaching Methods
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10
AI in Shadow Education: An Experimental Study in Hong Kong Tutorial Centers

von Ching Ho Richard Cheng

International Journal of Research in Education and Science. 2026 12(1):243-254.

Schlagworte: Foreign Countries; Artificial Intelligence; Computer Uses in Education; Private Education; Tutoring; English (Second Language); Second Language Instruction; Student Attitudes; Tutors; Teacher Attitudes; Administrator Attitudes; Secondary School Students
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11
Online Teaching during the COVID-19 Pandemic: Perspectives from Lecturers and Administrators in Malaysian Universities

von Sonali-J Suresh Kumar ; Cheng Ean Catherine Lee ; Angela Siew Hoong Lee ; et al.

Knowledge Management & E-Learning. 2026 18(1):60-92.

Schlagworte: COVID-19; Pandemics; Higher Education; College Administration; Administrator Role; College Faculty; Intention; Online Courses; Distance Education; Technology Uses in Education; Administrator Attitudes; Teacher Attitudes; Barriers; Foreign Countries; Satisfaction; Teacher Role; Instructional Effectiveness
- Zum Volltext in ERIC
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12
Humanoid Locomotion and Manipulation: Current Progress and Challenges in Control, Planning, and Learning

von Gu, Z. ; Li, J. ; Shen, W. ; et al.

IEEE/ASME Transactions on Mechatronics IEEE/ASME Trans. Mechatron. Mechatronics, IEEE/ASME Transactions on. 31(2):2300-2330 Apr, 2026
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13
A 3-nm FinFET 563-kbit 35.5-Mbit/mm2 Dual-Rail SRAM With 3.89-pJ/Access High Energy Efficient and 27.5-μW/Mbit One-Cycle Latency Low-Leakage Mode

von Aoyagi, Y. ; Nii, K. ; Yabuuchi, M. ; et al.

IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 61(4):1466-1476 Apr, 2026
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14
Suppression of Temperature Drift in Tunneling Magnetoresistance Current Sensors by Digital-Analog Hybrid Compensation

von Gao, J. ; Liu, J. ; Guan, M. ; et al.

IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 41(4):5567-5575 Apr, 2026
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15
Architecture and Implementation of O-RAN-based Local Breakout Service for Wi-Fi Devices

von Yao, Wan-Ru ; Wang, Jui-Tang ; Cheng, Yu-Hung ; et al.

2026 Open Conference of Electrical, Electronic and Information Sciences (eStream) Electrical, Electronic and Information Sciences (eStream), 2026 Open Conference of. :1-6 Apr, 2026
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16
AI Surrogate Model for PBGA Solder Fatigue Assessment Using Progressive Transfer Learning with Multi-fidelity Data

von Yuan, Cadmus ; Hong, Jian-Cheng ; Li, Pin-Sian

2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2026 27th International Conference on. :1-7 Apr, 2026
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17
Applying the Global-Local Approach with the Equivalent Structure for Reliability Assessment of the Multilevel Area Array Interconnects

von Yuan, Cadmus ; Lin, Si-Han ; Hong, Jian-Cheng

2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2026 27th International Conference on. :1-7 Apr, 2026
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18
A 28nm 11.2-to-20-GHz PLL-based 16-Phase Clock Generator with High-Order-Mode Ring Oscillator Achieving 24.3-fs Jitter for 320-Gsps-Sample-Rate Data Converter

von Ye, Zonglin ; Hou, Longxiang ; Sun, Yuxuan ; et al.

2026 IEEE Custom Integrated Circuits Conference (CICC) Custom Integrated Circuits Conference (CICC), 2026 IEEE. :1-4 Apr, 2026
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19
A 150-Msps 77-dB SNDR SAR ADC in 28-nm CMOS

von Yao, Bingbing ; Wen, Jiangfan ; Shen, Likai ; et al.

2026 IEEE Custom Integrated Circuits Conference (CICC) Custom Integrated Circuits Conference (CICC), 2026 IEEE. :1-4 Apr, 2026
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20
A 13-b 320-MS/s Noise-Successive-Attenuated SAR ADC with R-C-Traded-Off Reference Buffer

von Wen, Jiangfan ; Cheng, Qide ; Zhuo, Shenglong ; et al.

2026 IEEE Custom Integrated Circuits Conference (CICC) Custom Integrated Circuits Conference (CICC), 2026 IEEE. :1-4 Apr, 2026
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21
A Dual-Band Flat-Gain Power Amplifier with 19.3 dBm P1dB and 33.5% PAE1dB Empowered by the Novel Dual-Band Coupler for 64-/256/- QAM 5G NR Signals

von Huang, Pingyang ; Yang, Jilong ; Zhang, Li ; et al.

2026 IEEE Custom Integrated Circuits Conference (CICC) Custom Integrated Circuits Conference (CICC), 2026 IEEE. :1-4 Apr, 2026
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22
HyperV: A 130 HP-GFLOPS/W Out-of-Order RISC-V Vector Processor in 28 nm for Edge AI

von Ding, Andrew ; Cheng, Eric ; Chan, Eric ; et al.

2026 IEEE Custom Integrated Circuits Conference (CICC) Custom Integrated Circuits Conference (CICC), 2026 IEEE. :1-4 Apr, 2026
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23
D2CIM: A 28nm 53.3 TFLOPS/W Decoding Digital CIM Macro for Efficient FlashMLA-based LLM Inference

von Chen, Jia ; Xuan, Zihao ; Li, Yewen ; et al.

2026 IEEE Custom Integrated Circuits Conference (CICC) Custom Integrated Circuits Conference (CICC), 2026 IEEE. :1-4 Apr, 2026
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24
A 230GHz, 128-unit Zero-IF Phased Array RX utilizing 1-D SSPLL and DTC Phase Shifter

von Meng, Xiangao ; Li, Yan ; Yuan, Jun ; et al.

2026 IEEE Custom Integrated Circuits Conference (CICC) Custom Integrated Circuits Conference (CICC), 2026 IEEE. :1-4 Apr, 2026
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25
A 5nm 91.43 TOPS/W 4-Chiplet Generalizable-Rendering-Processor with UCIe-Enabled Cross-Die-Cache and Balance-Aware Progressive Multi-Level Sparsity

von Tan, Yonghao ; Ma, Songchen ; Dong, Pingcheng ; et al.

2026 IEEE Custom Integrated Circuits Conference (CICC) Custom Integrated Circuits Conference (CICC), 2026 IEEE. :1-4 Apr, 2026
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