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1
von Bernson, Robert ; Witte, Alex ; Clark, Genevieve ; et al.
Schlagworte: Quantum Physics
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2
von Bernson, Robert ; Wakeel, Saif ; Gupta, Parnika ; et al.
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :804-808 Dec, 2023
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von Gupta, Parnika ; Bernson, Robert ; Nudds, Noreen ; et al.
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :2160-2165 May, 2023
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4
von Malvicini, Giulia ; Waclawek, Johannes P. ; Pinto, Davide ; et al.
In Sensors and Actuators: B. Chemical 1 August 2024 412
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von Gunther, Sarah ; Gropp, Sebastian ; Hoffmann, Martin ; et al.
2018 European Conference on Optical Communication (ECOC) Optical Communication (ECOC), 2018 European Conference on. :1-3 Sep, 2018
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6
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7
von Gradkowski, Kamil ; Eason, Cormac ; Lee, Jun Su ; et al.
2016 6th Electronic System-Integration Technology Conference (ESTC) Electronic System-Integration Technology Conference (ESTC), 2016 6th. :1-5 Sep, 2016
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8
von Biaye, Moussa ; Amit, Yorai ; Gradkowski, Kamil ; et al.
The Journal of Physical Chemistry C. 123(23):14803-14812
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9
von Gupta, Parnika ; Mallik, Arun Kumar ; Krohnert, Kevin ; et al.
Gupta, P, Mallik, A K, Krohnert, K, Latkowski, S, Okonkwo, C, Alomari, S, Soumitra Kumar, D, Gradkowski, K, Morrissey, P E & O'Brien, P 2025, 'Thermal and Electrical Study of Glass Interposers in Co-Packaged Electronic–Photonic Systems', IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 15, no. 8, pp. 1625-1635. https://doi.org/10.1109/TCPMT.2025.3533388
Schlagworte: Co-packaging; electrical design; glass interposer; reference thermal chip; thermal management; through glass vias (TGVs)
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10
Schlagworte: Edge couplers; Expanded-beam optical connectors; Micro-optical devices; Photonic integrated circuits
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11
von Yilin Xu ; Pascal Maier ; Mareike Trappen ; et al.
Light: Advanced Manufacturing, Vol 4, Iss 2, Pp 77-93 (2023)
Schlagworte: photonic integration; photonic assembly; photonic packaging; additive laser manufacturing; multi-photon lithography; facet-attached microlenses; optical alignment tolerances; fiber-chip coupling; hybrid multi-chip modules; Manufactures; TS1-2301; Applied optics. Photonics; TA1501-1820
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12
von Gradkowski, Kamil ; O'Brien, Peter ; Taighde Éireann - Research Ireland
IEEE Transactions on Components, Packaging and Manufacturing Technology ; volume 15, issue 8, page 1601-1605 ; ISSN 2156-3950 2156-3985
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13
von Gradkowski, Kamil ; Hoogland, Gabrie ; Johnson, Peter M. ; et al.
IEEE Transactions on Components, Packaging and Manufacturing Technology ; volume 15, issue 8, page 1636-1643 ; ISSN 2156-3950 2156-3985
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14
von HOOGLAND, GABRIE ; GRADKOWSKI, KAMIL
Laser Focus World. Sep2025, Vol. 61 Issue 7, p15-18. 4p.
Schlagworte: *Mass production; *Assembly line methods; Thermoplastics; Microlenses; Micro-optics; Optical instruments; Integrated optics; Thermal stability
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15
von Slaba, Wioleta ; Janczak, Mikołaj ; Bogdanowicz, Karolina ; et al.
Vertical-Cavity Surface-Emitting Lasers XXX ; page 3
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von Johnson, Peter ; Godthi, Vamsy ; Hoogland, Gabrie ; et al.
Optical Interconnects and Packaging 2026 ; page 48
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von Gupta, Parnika ; Tanwar, Amit ; He, Xiuyun ; et al.
Journal of Optical Microsystems ; volume 4, issue 01 ; ISSN 2708-5260
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von Gradkowski, Kamil ; Morrissey, Padraic E ; O’Brien, Peter ; et al.
Journal of Physics: Photonics ; volume 6, issue 3, page 035022 ; ISSN 2515-7647
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von Ranno, Luigi ; Gupta, Parnika ; Gradkowski, Kamil ; et al.
ACS Photonics. 9(11):3467-3485
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20
von Wakeel, Saif ; Hall, Matthew ; Morrissey, Padraic E. ; et al.
Journal of Lightwave Technology ; volume 42, issue 24, page 8778-8786 ; ISSN 0733-8724 1558-2213
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von Ochalski, Tomasz J. ; Gradkowski, Kamil ; Pavarelli, Nicola ; et al.
2009 Conference on Lasers and Electro-Optics and 2009 Conference on Quantum electronics and Laser Science Conference Lasers and Electro-Optics, 2009 and 2009 Conference on Quantum electronics and Laser Science Conference. CLEO/QELS 2009. Conference on. :1-2 May, 2009
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23
von Xu, Yilin ; Maier, Pascal ; Trappen, Mareike ; et al.
Light: Advanced Manufacturing, 4 (2), 77-93 ; ISSN: 2831-4093
Schlagworte: ddc:620; Engineering & allied operations; info:eu-repo/classification/ddc/620
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von Wakeel, Saif ; Morrisey, Padraic E. ; Genc, Muhammet ; et al.
Journal of Optical Microsystems ; volume 4, issue 01 ; ISSN 2708-5260
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von Gradkowski, Kamil ; Stegall, David ; Mackey, David ; et al.
Journal of Lightwave Technology ; volume 41, issue 11, page 3470-3478 ; ISSN 0733-8724 1558-2213
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