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1
von Hans-Christoph Töpper ; Simon Scherrer ; Lucio Isa ; et al.
Scientific Reports, Vol 16, Iss 1 (2026)
Schlagworte: Particle charge characterization; Particle-electrode interactions; Gas insulation systems; Medicine; Science
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2
von Hans-Christoph Töpper ; Christian M. Franck
Scientific Reports, Vol 15, Iss 1, Pp 1-15 (2025)
Schlagworte: Gas insulation system; Electric charge; Particle tracking velocimetry; Medicine; Science
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3
von Sören Freerik Brähmer ; Benjamin Iffland ; Stefan Kreisel ; et al.
JMIR Serious Games, Vol 13, Pp e69812-e69812 (2025)
Schlagworte: Information technology; T58.5-58.64; Public aspects of medicine; RA1-1270
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4
von Braun, T. ; Becker, K.-F. ; Hoelck, O. ; et al.
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2018 International Conference on. :247-251 Apr, 2018
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5
von Bálint Czúcz ; Trond Simensen ; Astrid Brekke Skrindo ; et al.
Ecological Solutions and Evidence, Vol 6, Iss 1, Pp n/a-n/a (2025)
Schlagworte: biodiversity policy; degradation; ecological compensation; ecosystem condition; environmental impact assessment; Global Biodiversity Framework; Environmental sciences; GE1-350; Ecology; QH540-549.5
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6
von Wunderle, B. ; Manier, C.-A. ; Ras, M. Abo ; et al.
19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2013 19th International Workshop on. :253-261 Sep, 2013
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7
von Maus, S. ; Hansen, U. ; Leib, J. ; et al.
2010 Symposium on Design Test Integration and Packaging of MEMS/MOEMS (DTIP) Design Test Integration and Packaging of MEMS/MOEMS (DTIP), 2010 Symposium on. :242-246 May, 2010
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8
von Hansen, U. ; Maus, S. ; Leib, J. ; et al.
2010 Symposium on Design Test Integration and Packaging of MEMS/MOEMS (DTIP) Design Test Integration and Packaging of MEMS/MOEMS (DTIP), 2010 Symposium on. :237-241 May, 2010
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9
von Braun, T ; Becker, K. -F. ; Hoelck, O. ; et al.
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2019 6th International Workshop on. :9-9 May, 2019
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10
von Weiss, Florian M. ; Töpper, Tino ; Osmani, Bekim ; et al.
Langmuir. 32(13):3276-3283
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11
von Zlatkin-Troitschanskaia, Olga ; Pant, Hans Anand ; Toepper, M. ; et al.
Student Learning in German Higher Education : Innovative Measurement Approaches and Research Results. :1-6
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12
von Fritzsch, T. ; Mrossko, R. ; Baumgartner, T. ; et al.
2009 IEEE International Conference on 3D System Integration 3D System Integration, 2009. 3DIC 2009. IEEE International Conference on. :1-8 Sep, 2009
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13
von Jung, Erik ; Ostmann, A. ; Ramm, P. ; et al.
2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS Design, Test, Integration and Packaging of MEMS/MOEMS, 2008. MEMS/MOEMS 2008. Symposium on. :119-122 Apr, 2008
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14
von Isselhard, A ; Töpper, M ; Lautz, Z ; et al.
21. Deutscher Kongress für Versorgungsforschung (DKVF); 20221005-20221007; Potsdam; DOC22dkvf459 /20220930/
Schlagworte: ddc: 610
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15
von Zoschke, K. ; Wolf, J. ; Ehrmann, O. ; et al.
2007 9th Electronics Packaging Technology Conference Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th. :295-302 Dec, 2007
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16
von Maik Wiemer ; Chenping Jia ; Toepper, M. ; et al.
2006 1st Electronic Systemintegration Technology Conference Electronics Systemintegration Technology Conference, 2006. 1st. 2:1401-1405 Sep, 2006
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von A. Isselhard ; M. Töpper ; B. Berger-Höger ; et al.
Trials, Vol 21, Iss 1, Pp 1-13 (2020)
Schlagworte: Decision coaching; BRCA1 and BRCA2; Familial breast cancer; Familial ovarian cancer; Decision aid; Decision making; Medicine (General); R5-920
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19
von Kim, S. ; Buschick, K. ; Zoschke, K. ; et al.
2006 IEEE Workshop on Microelectronics and Electron Devices, 2006. WMED '06. Microelectronics and Electron Devices Microelectronics and Electron Devices, 2006. WMED '06. 2006 IEEE Workshop on. :2 pp.-16 2006
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20
von Dietrich, L. ; Toepper, M. ; Ehrmann, O. ; et al.
56th Electronic Components and Technology Conference 2006 Electronic Components & Technology Electronic Components and Technology Conference, 2006. Proceedings. 56th. :10 pp. 2006
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21
von Tetelin, A. ; Pellet, C. ; Achen, A. ; et al.
IEEE Sensors, 2005. Sensors Sensors, 2005 IEEE. :4 pp. 2005
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22
von Lin, D.-S. ; Wodnicki, R. ; Zhuang, X. ; et al.
IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control IEEE Trans. Ultrason., Ferroelect., Freq. Contr. Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on. 60(7):1356-1375 Jul, 2013
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23
von Bauer, E. ; Toepper, M. ; Gebhardt, H. ; et al.
In Brain Research 5 October 2015 1622:137-148
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24
von Sharma, A. ; Rieth, L. ; Tathireddy, P. ; et al.
In Sensors & Actuators: A. Physical December 2012 188:167-172
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25
von Hörner, K. D. ; Budwitz, M. ; Röhm, E. J. ; et al.
Optical Methods and Physics of Colloidal Dispersions. 104:23-30
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