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von Wernicke, T. ; Lindner, P. ; Uhrmann, T. ; et al.
2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023
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von Michaud, L.G. ; Abadie, K. ; Fournel, F. ; et al.
2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2024 8th International Workshop on. :1-1 Oct, 2024
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von Peng, L. ; Kim, S-W ; Iacovo, S. ; et al.
2018 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2018 IEEE International. :179-181 Jun, 2018
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von Cariou, R. ; Benick, J. ; Beutel, P. ; et al.
IEEE Journal of Photovoltaics IEEE J. Photovoltaics Photovoltaics, IEEE Journal of. 7(1):367-373 Jan, 2017
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von Matthias, T. ; Kim, B. ; Wimplinger, M. ; et al.
3rd Electronics System Integration Technology Conference ESTC Electronic System-Integration Technology Conference (ESTC), 2010 3rd. :1-6 Sep, 2010
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von Dragoi, V. ; Glinsner, T. ; Mittendorfer, G. ; et al.
Proceedings. International Semiconductor Conference Semiconductor conference Semiconductor Conference, 2002. CAS 2002 Proceedings. International. 2:331-334 vol.2 2002
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von Teh, W.H. ; Deeb, C. ; Burggraf, J. ; et al.
2010 IEEE International Interconnect Technology Conference Interconnect Technology Conference (IITC), 2010 International. :1-3 Jun, 2010
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von Eibelhuber, M. ; Razek, N. ; Dragoi, V. ; et al.
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) Electronics Packaging and Technology Conference (EPTC), 2015 IEEE 17th. :1-2 Dec, 2015
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von Razek, N. ; Flotgen, C. ; Dragoi, V. ; et al.
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2017 5th International Workshop on. :23-23 May, 2017
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10
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11
von Abadie, K. ; Montméat, P. ; Enot, T. ; et al.
In International Journal of Adhesion and Adhesives June 2019 91:123-130
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von Lindner, P. ; Glinsner, T. ; Uhrmann, T. ; et al.
2012 IEEE International SOI Conference (SOI) SOI Conference (SOI), 2012 IEEE International. :1-2 Oct, 2012
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von Rebhan, B. ; Tollabimazraehno, S. ; Plach, T. ; et al.
2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on. :53-53 May, 2012
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von Plach, T. ; Hingerl, K. ; Dragoi, V. ; et al.
2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on. :145-145 May, 2012
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von Teyssedre, H. ; Landis, S. ; Brianceau, P. ; et al.
SPIE Proceedings ; Emerging Patterning Technologies ; volume 10144, page 101440V ; ISSN 0277-786X
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von Niklaus, F. ; Kumar, R. J. ; McMahon, J. J. ; et al.
MRS Online Proceedings Library. 863(1)
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von Dragoi, V. ; Lindner, P. ; Glinsner, T. ; et al.
MRS Online Proceedings Library. 782(1)
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von Wimplinger, M. ; Lu, J.-Q. ; Yu, J. ; et al.
MRS Online Proceedings Library. 812(1)
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von Teyssedre, H. ; Landis, S. ; Thanner, C. ; et al.
SPIE Proceedings ; 32nd European Mask and Lithography Conference ; volume 10032, page 100320M ; ISSN 0277-786X
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von Cariou, Romain ; Benick, Jan ; Feldmann, Frank ; et al.
Schlagworte: 621; 697
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von Miller, R. ; Glinsner, T. ; Kreindl, G. ; et al.
SPIE Proceedings ; Alternative Lithographic Technologies ; volume 7271, page 72712J ; ISSN 0277-786X
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von Matthias, T. ; Wimplinger, M. ; Pauzenberger, G. ; et al.
2013 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) ; page 1-1
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